Xiaomi launches new AI chips made with TSMC

Xiaomi has unveiled a new generation of in-house processors, including an AI-focused chip, all manufactured by TSMC.

The company announced the Xring O3 smartphone processor on Monday, while two other chips, the Xring O100 for AI tasks and the Xring D100 for autonomous driving, have completed development and are set for deployment next year, according to sources familiar with the matter, as per a recent report by Reuters.

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The Xring O3 is built on TSMC's 3-nanometre process and will power Xiaomi's upcoming flagship foldable phone. Xiaomi has targeted shipments of 200,000 to 300,000 units for the O3, one source said to Reuters. The company said the chip has already entered mass production.

The Xring O100 is a 6-nanometre neural processing unit designed to support Xiaomi's MiMo large language model on consumer devices. The D100, a 3-nanometre chip, will handle autonomous driving functions. Both chips have been contracted to TSMC, as per Reuters.

Xiaomi has invested more than 20 billion yuan ($3 billion) in Xring chip development, and its semiconductor design team has grown to over 3,000 people from 2,500 last year, according to the Reuters report. The company first launched the Xring O1 a year ago, with cumulative shipments of devices using that chip surpassing one million units.

The push into proprietary AI and mobile processors follows similar moves by Apple, Samsung, and Huawei. Xiaomi and TSMC did not respond to requests for comment from Reuters on production or shipment targets.